Project

General

Profile

Auerswald COMmander Basic2 Electronics » History » Version 4

laforge, 02/20/2022 02:22 PM

1 1 laforge
h1. Auerswald COMmander Basic2 Electronics
2
3
h2. Mainboard
4
5
{{thumbnail(Auerswald_COMB2_mainboard1.jpg)}}
6
{{thumbnail(Auerswald_COMB2_mainboard2.jpg)}}
7
{{thumbnail(Auerswald_COMB2_mainboard_detail.jpg)}}
8
9
h2. 8 S0 Module
10
11 3 laforge
As can be seen clearly on the picutre, it uses the [[CologneChip_HFC|CologneChip HFC-8S]] 8-port S/T interface IC.  There's a lattice glue logic chip for interfacing with the backplane bus, and the analog frontend + magnetics sections for 8 ports.  Four ports have jumper blocks to change the NT/TE cross-over, while the other 4 ports are static.
12
13 2 laforge
{{thumbnail(Auerswald_COMmander_8S0_top.jpg)}}
14
{{thumbnail(Auerswald_COMmander_8S0_bottom.jpg)}}
15
16 1 laforge
h2. 4 S0 Module
17
18 2 laforge
This isba basically just a partially populated 8S0 module, using a HFC-4S chip instead of the HFC-8S.
19
20
{{thumbnail(Auerswald_COMmander_4S0.jpg)}}
21
{{thumbnail(Auerswald_COMmander_4S0_top.jpg)}}
22
{{thumbnail(Auerswald_COMmander_4S0_bottom.jpg)}}
23
24 1 laforge
h2. 8 a/b Module
25
26 2 laforge
{{thumbnail(Auerswald_COMmander_8ab_top.jpg)}}
27
{{thumbnail(Auerswald_COMmander_9ab_bottom.jpg)}}
28
{{thumbnail(Auerswald_COMmander_8ab.jpg)}}
29
30 1 laforge
h2. S2M Module
31 2 laforge
32 4 laforge
The S2M (PRI) module is centered around an Infineon PEF2256E FALC56 chip. This is one of the most common E1 framers on the market.
33
34
The glue logic for interfacing with the backplane/bus is implemented in a Xilinx CPLD.
35
36 2 laforge
{{thumbnail(Auerswald_COMmander_S2M_top.jpg)}}
37
{{thumbnail(Auerswald_COMmander_S2m_bottom.jpg)}}
Add picture from clipboard (Maximum size: 48.8 MB)