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laforge, 05/02/2017 09:05 PM

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h1. Hardware
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h2. Physical Setup / Board Stacking
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The hardware consists of two circuit boards:
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* Top board: AC/DC power supply and Ethernet switch
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* Bottom board: Actual Femtocell mainboard
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The two boards are sandwiched together by the following connections:
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* 6-pin fine-pitch connector (most likely for DC power)
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* flexible printed circuit cable (most likely for Ethernet MII/RMII)
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* two large sheet metal parts for ground and/or thermal connection
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It is thus not very straight forward to operate the opened device in a safe way (i.e. without live AC line voltage present).
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We will be working on a way to operate it with injected safe low DC voltage, but that is still TBD.
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h2. Major Components
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h3. Femtocell SoC
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Broadcomm BCM61610KFB1G (formerly Percello)
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* no information found anywhere
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h3. NAND Flash
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Hynix H27U1G8F2BTR
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* 1Gbit (128MByte) NAND Flash, x8 data bus, 3.3V, 2k page size, 128k erase block, 48pin TSOP1
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* http://natisbad.org/NAS/refs/Hynix_NAND_128Mo_H27U1G8F2BT.pdf
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h2. RF Transceiver
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Maxim MAX2550
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* Band I, V, and VIII WCDMA Femtocell Transceiver with GSM Monitoring
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* https://www.maximintegrated.com/en/products/comms/wireless-rf/MAX2550.html
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* https://datasheets.maximintegrated.com/en/ds/MAX2550.pdf
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* https://www.maximintegrated.com/en/app-notes/index.mvp/id/5364
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